Specifications | PCI-SIG - Kiến Thức Cho Người lao Động Việt Nam

Unordered IO (UIO) ECN

Defines a new wire semantic and related capabilities…

Defines a new wire semantic and related capabilities for addressing the limitations of the PCI/PCIe fabric-enforced ordering rules. Specifically: Fabrics with multiple paths between a source and destination cannot be supported; posted Writes don’t match the semantics of other fabrics, in that the Requester doesn’t (directly) know if/when a write has actually completed; and writes flowing towards destinations with differing write performance can cause global stalls

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1.x

ECN

M.2-1A Add-in Card and Connector Amperage Improvement

This proposal introduces a new version of the M.2 co…

This proposal introduces a new version of the M.2 connector with improved amperage per pin to 1A, and card outline changes with increased component area options.

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1.x

ECN

Update to Transmitter Jitter requirements at 32.0 GT/s ECN

This ECR removes the transmitter jitter test require…

This ECR removes the transmitter jitter test requirement for 32 GT/s systems. Transmitter jitter test remains a requirement for 32 GT/s Add-in Cards.

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5.x

ECN

PCI Code and ID Assignment Specification Revision 1.15

This specification contains the Class Code and Capab…

This specification contains the Class Code and Capability ID descriptions originally contained the PCI Local Bus Specification, bringing them into a standalone document that is easier to reference and maintain. This specification also consolidates Extended Capability ID assignments from the PCI Express Base Specification and various other PCI specifications. It is intended that this document be used along with the PCI Express Base Specification Revision 5.0.

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1.x

Specification

12VHPWR Cable Plug Update ECN

This ECN replaces existing drawings for the 12VHPWR …

This ECN replaces existing drawings for the 12VHPWR cable plug with 2 different options.

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5.x

ECN

Alternate Protocol DLLP Reservation

CXL 3.0 defines an alternate protocol and has asked …

CXL 3.0 defines an alternate protocol and has asked for a DLLP assignment. They want to use a DLLP instead of a Flit_Marker to reduce their latency (this issue is unique to their protocol – PCIe does not have this issue).

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6.x

ECN

Expanding Power Excursion Spec to All Power Levels of PCIe AICs and to CEM Connector Power Rails ECN

Expands power excursion to 12V power rail in PCIE CE…

Expands power excursion to 12V power rail in PCIE CEM connector in addition to 12VHPWR and 48VHPWR connectors but excludes legacy 2×3 and 2×4 auxiliary power connectors from power excursion specification.

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5.x

ECN

PCI Express M.2 Specification Revision 4.0, Version 1.1

The M.2 form factor is intended for Mobile Adapters….

The M.2 form factor is intended for Mobile Adapters. The M.2 is a natural transition from the Mini Card and Half-Mini Card (refer to the PCI Express Mini CEM Specification) to a smaller form factor in both size and volume. The M.2 is a family of form factors that enables expansion, contraction, and higher integration of functions onto a single form factor module solution.

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4.x

Specification

PCI Express M.2 Specification Revision 4.0, Version 1.1 (Change Bar Version)

The M.2 form factor is intended for Mobile Adapters….

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4.x

Specification

Auxiliary Signal Leakage and Capacitance Increase ECN

This ECR increases the specified leakage and capacit…

This ECR increases the specified leakage and capacitance tolerances for Auxiliary I/O signals.

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4.x

ECN

Data Object Exchange (DOE), Revision 1.1

This ECR defines a revised and extended Data Object …

This ECR defines a revised and extended Data Object Exchange mechanism. This ECN builds 5 upon the content defined in the ECN that defined the original revision of Data Object Exchange, published 26 March 2020 (document date of 12 March 2020).

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1.x

ECN

1.8V IO for LGAs

This ECN adds 1.8V IO support to Type 1216, Type 222…

This ECN adds 1.8V IO support to Type 1216, Type 2226, and Type 3026 LGAs. This support adds two previously defined pins to these LGAs: • VIO_CFG, a 1.8V IO support indication (one pin) • VIO 1.8V, a 1.8V IO Voltage source (one pin) The VIO 1.8 V signal is intended as an IO supply and reference voltage for host interface sideband signals PERST#, CLKREQ#, and PEWAKE# and additional signals such as SUSCLK, W_DISABLE1#, W_DISABLE2#. This provides IO voltage flexibility to enable IO voltage levels other than 3.3V in the applicable M.2 form factors. The VIO_CFG signal is intended to provide the Platform an indication of the IO voltage capabilities of the M.2 Adapter installed. In cases where the Platform detects that an incompatible Adapter is installed, the Platform may choose to not power the Adapter or isolate the affected sideband signals to avoid damage or interface instability.

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4.x

ECN

PCI Express Base Specification Revision 6.0.1, Version 1.0

This specification describes the PCI Express® archit…

This specification describes the PCI Express® architecture, interconnect attributes, fabric management, and the
programming interface required to design and build systems and peripherals that are compliant with the PCI Express
Specification. This document defines the “base” specification for the PCI Express architecture, including the electrical, protocol,
platform architecture and programming interface elements required to design and build devices and systems.

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1.x

Specification

PCI Express Base Specification Revision 6.0.1, Version 1.0 (Change Bar Version)

This is a change bar version of the PCI Express Base…

This is a change bar version of the PCI Express Base 6.0 Specification comparing Base 6.0/1.0 to Base 6.0.1/1.0

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1.x

Specification

TEE Device Interface Security Protocol (TDISP)

This document defines the TEE Device Interface Secur…

This document defines the TEE Device Interface Security Protocol (TDISP) – An architecture for trusted I/O virtualization providing the following functions: 1. Establishing a trust relationship between a TVM and a device. 2. Securing the interconnect between the host and device. 3. Attach and detach a TDI to a TVM in a trusted manner.

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5.x

ECN

Lane Margining Test Extensions ECN

Expansion of example methods for lane …

Expansion of example methods for lane margining testing to create different electrical link conditions for the two test runs. These changes apply to both Add-in Card and System testing.
Adding a repeatability test option as proof that lane margining measurement is implemented.

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1.x

ECN

PCI Express Retimer Test Specification Revision 4.0, Version 1.0

This test specification is intended to confirm if a …

This test specification is intended to confirm if a stand-alone Retimer is compliant to the PCI Base Specification.

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4.x

Specification

Add core voltage 0.75 V in PWR_3 rail for BGA SSD

Summary of the Functional Changes…

Summary of the Functional Changes
I. Add core voltages 0.75 V in PWR_3 rail for BGA SSD.
II. Add new pin configuration including 0.75 V pin.

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4.x

ECN

12VHPWR Sideband Allocation and Requirements

Summary of the Functional Changes…

Summary of the Functional Changes
Changing the RFU pin in the 12VHPWR connector sideband to Sense1. Adding 150W and 300W power capabilities to the encoding options for Sense0 and Sense1. Makes Card_CBL_PRES required to be tied to ground with 4.7 kΩ resistor.

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5.x

ECN

PCI Express Architecture PHY Test Specification, Revision 5.0, Version 1.0

This document provides test descriptions for PCI Exp…

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5.x

Specification

PCI Express Architecture Configuration Space Test Specification Revision 5.0, Version 1.0

This document primarily covers PCI Express testing o…

This document primarily covers PCI Express testing of all defined Device Types and RCRBs for the standard Configuration Space mechanisms, registers, and features.

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5.x

Specification

PCI Express Architecture Link Layer and Transaction Layer Test Specification Revision 5.0, Version 1.0

This test specification primarily covers testing of …

This test specification primarily covers testing of PCI Express® Device and Port types for compliance with the link layer and transaction layer requirements of the PCI Express Base Specification.

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5.x

Specification

Transmitter Jitter requirements at 32.0 GT/s ECN

Transmitter jitter requirements at 32 GT/s are being…

Transmitter jitter requirements at 32 GT/s are being added for system board and Add-in Card.

Affected Document: PCI Express Card Electromechanical Specification Revision 5.0, Version 1.0

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5.x

ECN

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.2

This document provides test descriptions for PCI Exp…

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4.x

Specification

PCI Express Base Specification Revision 6.0, Version 1.0 (Change Bar Versions)

There are two informative “changebar” versions of th…

There are two informative “changebar” versions of the PCI Express Base 6.0 Specification comparing Base 6.0/1.0 to Base 6.0/0.9 and comparing Base 5.0 to Base 6.0.

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6.x

Specification

PCI Express Base Specification Revision 6.0, Version 1.0

This specification describes the PCI Express® archit…

This specification describes the PCI Express® architecture, interconnect attributes, fabric management, and the programming interface required to design and build systems and peripherals that are compliant with the PCI Express Specification. This document defines the “base” specification for the PCI Express architecture, including the electrical, protocol, platform architecture and programming interface elements required to design and build devices and systems.

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6.x

Specification

Integrity and Data Encryption (IDE) ECN – Revision A

Original IDE ECN plus IDE items included in final Ba…

Original IDE ECN plus IDE items included in final Base 5.0 Errata. Changebar version relative to original IDE ECN also available.

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5.x

ECN

Errata for the PCI Express Base Specification Revision 5.0

…

Corresponds to Errata included in Base 6.0, Version 0.9 and Version 1.0

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5.x

Errata

Integrity and Data Encryption (IDE) ECN – Revision A (Change Bar)

This is a change bar version of the Integrity and Da…

This is a change bar version of the Integrity and Data Encryption (IDE) ECN – Revision A.

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5.x

ECN

PWRDIS Asserted Hold Time Reduction

This ECR establishes two operational modes for use o…

This ECR establishes two operational modes for use of the Power Disable (PWRDIS) signal. The existing mode allowed use of the signal for coordinated shutdown of the PCIe device, but was optimized for a power-on reset of a non-responsive device. The new mode reduces PWRDIS minimum asserted hold time from 5 s to 100 ms for use in a coordinated shutdown with an emphasis on entry and exit times from D3cold.

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4.x

ECN

(CEM WG) | Power Excursion Limits for 300-600 W PCIe AICs ECN

This change allows for cards to exceed maximum power…

This change allows for cards to exceed maximum power levels currently defined in the CEM spec to enable higher performance for certain workloads. This change clearly defines limits for these excursions to allow system designers to properly design power subsystems to enable these excursions.

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5.x

ECN

(PWG) | Relaxed Detect Timing ECN

The long-standing requirement for a component’s LTSS…

The long-standing requirement for a component’s LTSSM to enter Detect state within 20 ms of the end of Fundamental Reset is relaxed (extended) to 100 ms for components that support >5 GT/s Link speeds.

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5.x

ECN

PCI Code and ID Assignment Specification

This specification contains the Class Code and Capab…

It is intended that this document be used along with the PCI Express Base Specification Revision 5.0.

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1.x

Specification

M.2 3052 3060 WWAN Module

Add 3052 and 3060 form factors for WWAN modules usin…

Add 3052 and 3060 form factors for WWAN modules using Socket 2 with Key B and Key C.

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4.x

ECN

Tx Jitter Measurement Methodology at 32.0 GT/s ECN

Describes a method to measure Tx jitter parameters a…

Describes a method to measure Tx jitter parameters at 32 GT/s accurately by using a Jitter Measurement Pattern. This replaces the S-parameter de-embedding method. In this method, a CTLE-based equalization instead of S-parameter based de-embedding gain filter is applied to the captured Tx waveform to mitigate signal degradation due to frequency-dependent channel loss. The CTLE-based equalization is defined by the 32 GT/s reference CTLE curves. The proposed method with the use of clock pattern in the lane under test and compliance pattern in other lanes avoids the inaccuracy of the S-parameter based de-embedding that results from the amplification of the real-time oscilloscope floor noise by the de-embedding gain filter. The Tx jitter measurement methods for 8.0 and 16.0 GT/s have been kept unchanged.

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5.x

ECN

Fitting-based Tx Preset Measurement Methodology for 8.0, 16.0, and 32.0 GT/s ECN

Introduces a fitting-based Tx preset measurement met…

Introduces a fitting-based Tx preset measurement methodology that extracts Tx equalization coefficients from measured step responses with and without Tx equalization. Consequently, it overcomes a few limitations of the current DC voltage-level based methodology where the ratio of DC voltage levels of various presets is used to avoid measurement complexity due to high frequency-dependent loss. Since the use of the ratio of DC voltage levels do not guarantee the correct use of Tx equalization coefficients and constant voltage swing across presets, the existing DC voltage-level based measurement methodology may give incorrect results if the Tx equalization coefficients and voltage swing significantly deviate from the intended values for the specified Tx presets.

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5.x

ECN

(PWG) | Combined Power ECN (Change Bar)

This is a change to the PCI Express Base Specificati…

This is a change to the PCI Express Base Specification, Revision 5.0.

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5.x

ECN

(PWG) | Combined Power ECN

This is a change to the PCI Express Base Specificati…

This is a change to the PCI Express Base Specification, Revision 5.0.

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5.x

ECN

PCI Express Card Electromechanical Specification Revision 5.0

This Card Electromechanical (CEM) specification is a…

This Card Electromechanical (CEM) specification is a companion for the PCI Express® Base Specification, Revision 5.0. Its primary focus is the implementation of an evolutionary strategy with earlier PCI™ desktop/server mechanical and electrical specifications.

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5.x

Specification

PCI Express Card Electromechanical Specification Revision 5.0 (Change Bar)

This Card Electromechanical (CEM) specification is a…

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5.x

Specification

PCI Express SFF-8639 Module Specification Revision 4.0, Version 1.0 (Clean)

The focus of this specification is on PCI Express® (…

The focus of this specification is on PCI Express® (PCIe®) solutions utilizing the SFF-8639 connector interface. Form factors include, but are not limited to, those described in the SFF-8201 Form Factor Drive Dimensions Specification. Other form factors, such as PCI Express Card Electromechanical are documented in other independent specifications.

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4.x

Specification

(Firmware WG) | PCI Firmware Specification Revision 3.3 (Change Bar)

This document describes the hardware independent fir…

This document describes the hardware independent firmware interface for managing PCI, PCI-X, and PCI Express™ systems in a host computer.

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3.x

Specification

(Firmware WG) | PCI Firmware Specification Revision 3.3 (Clean)

This document describes the hardware independent fir…

This document describes the hardware independent firmware interface for managing PCI, PCI-X, and PCI Express™ systems in a host computer.

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3.x

Specification

(M.2) | Voltage Indication for PCIe BGA 1113 SSD and 1.0 V PWR3 Support ECN

Proposes repurposing five RFU pins in the Type 1113 …

Proposes repurposing five RFU pins in the Type 1113 (11.5mm x 13mm) BGA ball map to be optionally used for indicating PWR1, PWR2, and PWR3 supply voltage requirements to the platform. If this ECR is implemented then all 5 pins need to be implemented. Adds a 1.0 V power supply option for PWR3 for both BGA1113 and BGA1620.

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4.x

ECN

(PWG) | Integrity and Data Encryption (IDE) ECN

Integrity & Data Encryption (IDE) provides confi…

Integrity & Data Encryption (IDE) provides confidentiality, integrity, and replay protection for TLPs. It flexibly supports a variety of use models, while providing broad interoperability. The cryptographic mechanisms are aligned to current industry best practices and can be extended as security requirements evolve. The security model considers threats from physical attacks on Links, including cases where an adversary uses lab equipment, purpose-built interposers, malicious Extension Devices, etc. to examine data intended to be confidential, modify TLP contents, & reorder and/or delete TLPs. TLP traffic can be secured as it transits Switches, extending the security model to address threats from reprogramming Switch routing mechanisms or using “malicious” Switches. Compared to the Member Review copy, and consistent with the “NOTICE TO REVIEWERS” in that copy, this final revision contains significant revisions to the key management protocol in order to align it closely with the DMTF’s Secured Messages using SPDM Specification, which was not available at the time the Member Review copy was prepared. Additionally, the final copy includes significant improvements in protection against Adversary-in-the-Middle attacks, and, consistent with member feedback received in response to the query regarding key size for AES-GCM applied to IDE TLPs, supports only the 256b key size.

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5.x

ECN

PCI Express M.2 Specification Revision 4.0, Version 1.0 (Change Bar)

The M.2 form factor is intended for Mobile Adapters….

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4.x

Specification

PCI Express M.2 Specification Revision 4.0, Version 1.0 (Clean)

The M.2 form factor is intended for Mobile Adapters….

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4.x

Specification

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.01A (Clean)

This document provides test descriptions for PCI Exp…

This document provides test descriptions for PCI Express electrical testing. It is relevant for anyone building Add-in Cards or system boards to the PCI Express Card Electromechanical Specification 4.0. This specification does not describe the full set of PCI Express tests and assertions for these devices

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4.x

Specification

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.01A (Change Bar)

This document provides test descriptions for PCI Exp…

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4.x

Specification

(PWG) | Translated Memory Requests with PASID ECN

Loosens restrictions on use of PASID to allow PASID …

Loosens restrictions on use of PASID to allow PASID to be applied to Memory Requests using Translated addresses (AT=Translated).

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5.x

ECN

1.8V sideband, Power Loss Notification, USB 2.0, and higher power support, Revision B

Revision B (July 22, 2020) corrects an errata in the…

Revision B (July 22, 2020) corrects an errata in the original revision (November 28, 2018). PWRDIS timings were incorrectly specified as a maximum when they are meant to be specified as a minimum value. The affected portion is highlighted in Table 3-26 PWRDIS AC characteristics.

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1.x

ECN

(OCuLink WG) | PCI Express OCuLink Specification Revision 1.1

This document is a companion specification to the PC…

This document is a companion specification to the PCI Express Base Specification and other PCI Express® documents listed in Section 1.1. The primary focus of the PCI Express OCuLink Specification is the implementation of internal and external small form factor PCI Express connectors and cables. This form factor supports multiple market segments, from client, mobile, server, datacenter, and storage. This specification discusses cabling and connector requirements to meet the 8.0 GT/s signaling needs in the PCI Express Base Specification.

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1.x

Specification

(M.2 WG) | M.2 Socket-1 Enhancements ECN

The changes are to Socket-1, Keys E and A-E…

The changes are to Socket-1, Keys E and A-E
Addition of 1.8V IO support type (1 pin)
Addition of 1.8V IO Voltage source (1 pin)
Addition of WI-FI_DISABLE and BT_DISABLE signals overlaid onto W_DISABLE1#, W_DISABLE2#
Additional antenna assignment which allows for multiple Bluetooth antennas.

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3.x

ECN

(M.2 WG) | Add Core Voltage 0.8 V in PWR_3 for BGA SSD ECN

Add core voltages 0.8 V in PWR_3….

Add core voltages 0.8 V in PWR_3.
II. Add new pin configuration including 0.8 V.

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3.x

ECN

Cin Maximum Increase ECN

Smaller lithography has led to smaller pad sizes whi…

Smaller lithography has led to smaller pad sizes which has increased parasitics on inputs. For the Card Electromechanical Specification, this ECR increases Cin, the maximum input pin capacitance on 3.3 V logic signals (applies to PERST# and PWRBRK#) from 7 pF to 20 pF (see CEM Table 3).

For the M.2 specification, this ECR increases M.2 CIN, the maximum input pin capacitance for both 3.3 V logic signal (applies to PERST#, see M.2 Table 4-1) and 1.8 V logic signals (applies to PERST# and PEWAKE# (when used for OBFF signaling), see M.2 Table 4-2) from 10 pF to 20 pF. This capacitance increase is large enough for known upcoming lithographies.

It had not been clear what the measurement point was for CIN in CEM or M.2 specifications. This 18 ECN extends the COUT measurement point specified in M.2 to apply to CIN and COUT for both 19 CEM and M.2 specifications.

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4.x

ECN

High Power M.2 Heat Spreader ECN

This proposal introduces an additional width, compon…

This proposal introduces an additional width, component heights, and the ability to specify the top surface as a planar.

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3.x

ECN

PCI Express External Cabling Specification Revision 3.0a (Change Bar)

This is a companion specification to the PCI Express…

This is a companion specification to the PCI Express Base Specification. The primary focus of this specification is the implementation of cabled PCI Express®. No assumptions are made regarding the implementation of PCI Express-compliant Subsystems on either side of the cabled Link (PCI Express Card Electromechanical (CEM), ExpressCard™, ExpressModule™, PXI Express™, or any other form factor). Such form factors are covered in separate specifications

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4.x

Specification

PCI Express External Cabling Specification Revision 3.0a (Clean)

This is a companion specification to the PCI Express…

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3.x

Specification

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.01 (Change Bar)

This document provides test descriptions for PCI Exp…

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4.x

Specification

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.01 (Clean)

This document provides test descriptions for PCI Exp…

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4.x

Specification

Component Measurement and Authentication (CMA) ECN

This ECR defines an adaptation of the data objects a…

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This ECR defines an adaptation of the data objects and underlying protocol defined in the DMTF SPDM specification ( https://www.dmtf.org/dsp/DSP0274 ) for PCIe components, providing a mechanism to verify the component configuration and firmware/executables (Measurement) and hardware identities (Authentication). “Firmware” in this context includes configuration settings in addition to executable code. This protocol can be operated via the Data Object Exchange (DOE) mechanism, or through other means, for example via MCTP messaging conveyed using PCIe Messages, or via SMBus, I2C, or other management I/O. Data Object Exchange (DOE) is defined in the Data Object Exchange ECN to the PCIe Base Specification Rev 4.0, 5.0, approved on 12 Mar 2020.

5.x

ECN

Deferrable Memory Write (DMWr) and Device 3 Extended Capability ECN

This ECN defines a new Request, the Deferrable Memor…

This ECN defines a new Request, the Deferrable Memory Write (DMWr), that requires the Completer to return an acknowledgement to the Requester, and provides a mechanism for the recipient to defer (temporarily refuse to service) the Request.

To provide space for the required control registers, this ECN also defines an Extended Capability, the Device 3 Extended Capability, to provide Device Capabilities 3, Device Control 3, and Device Status 3 registers. This Extended Capability is required for DMWr support, but can also be applied to other uses besides DMWr, and therefore can be implemented by Functions that do not support DMWr.

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5.x

ECN

Data Object Exchange (DOE) ECN

This ECR defines an optional Extended Capability str…

This ECR defines an optional Extended Capability structure and associated control mechanisms to provide System Firmware/Software the ability to perform data object exchanges with a Function or RCRB.

To support Component Measurement and Authentication (CMA) accessible in-band via host firmware/software, Data Object Exchange (DOE) is required, and CMA motivates the need for DOE, although broader uses are anticipated.

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5.x

ECN

1.8V Sideband, Power Loss Notification, USB 2.0, and Higher Power Support ECN, Revision A

Revision A (March 4, 2020) corrects an oversight in …

Revision A (March 4, 2020) corrects an oversight in the original revision (November 28, 2018). The Socket 2 Key B PCIe/USB3.1 Gen1-based WWAN Adapter Pinout was not updated to reflect the addition of 1.8V sideband support like the other tables. The affected portion is highlighted in Table 33 Socket 2 Key B PCIe/USB3.1 Gen1-based WWAN Adapter Pinout.

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3.x

ECN

PCI Code and ID Assignment Specifications

This specification contains the Class Code and Capab…

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1.x

Specification

ATS Memory Attributes ECN, Revision A

Revision A (January 30, 2020) corrects an error in t…

Revision A (January 30, 2020) corrects an error in the original revision (September 29, 2019). The ATS Memory Attributes Supported field in the ATS Capabilities Register is now assigned bit location 8. It was previously assigned bit location 7. The affected text is highlighted in Table 10-9: ATS Capability Register.

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5.x

ECN

ATS Memory Attributes ECN, Revision A

4.x

ECN

Shadow Functions ECN

Shadow Functions are permitted to be assigned only w…

Shadow Functions are permitted to be assigned only where currently unused Functions reside. The Function declaring the shadowing is permitted to overflow its Transaction ID space over into the Shadow Function. The impetus for defining Shadow Functions is to provide more Transaction ID space without increasing the Tag field, since there are no straightforward means to do that at the current time.

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5.x

ECN

Shadow Functions ECN

4.x

ECN

Shadow Functions ECN

5.x

ECN

PTM Byte Adaptation ECN

Due to ambiguity in earlier versions of the PCIe Bas…

Due to ambiguity in earlier versions of the PCIe Base Specification two different interpretations of the byte positions in the PTM ResponseD Message Propagation Delay field have been implemented. This ECR defines mechanisms that new hardware can implement to support the adaptation to either of the interpretations.

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5.x

ECN

PTM Byte Adaptation ECN

4.x

ECN

PTM Byte Adaptation ECN

5.x

ECN

PCI Express External Cabling Specification Revision 3.0, Version 1.0

This is a companion specification to the PCI Exp…

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3.x

Specification

PCI Express OCuLink Specification Revision 1.0a

DISCLAIMER: Table A-1, Bytes 0 to 1…

DISCLAIMER: Table A-1, Bytes 0 to 127 (Lower Memory Fields), contained an error in the 1.0 Specification. Byte 0, Identifier, was 0Eh and has been changed to 1Ch.

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1.x

Specification

Manufacturer Test Mode Pin ECN

High Volume Manufacturing (HVM) and other manufactur…

High Volume Manufacturing (HVM) and other manufacturer test processes benefit from the ability to set Add-in Card (AIC) modes that enable multiplexing of standard connector pins for test specific use. This ECR defines a method to allow the system to enable a Manufacturer Test Mode (MFG) on the AIC through the standard interface connector prior to shipping the AIC. This ECR to the CEM specification is consistent with Manufacturing Mode ECN to the SFF-8639 specification.

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4.x

ECN

PCI Express Card Electromechanical Specification Revision 4.0, Version 1.0 (Clean)

This specification is a companion for the PCI Expres…

This specification is a companion for the PCI Express® Base Specification, Revision 4.0. Its primary focus is the implementation of an evolutionary strategy with the current PCI™ desktop/server mechanical and electrical specifications.

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4.x

Specification

PCI Express Card Electromechanical Specification Revision 4.0, Version 1.0 (Change Bar)

This specification is a companion for the PCI Expres…

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4.x

Specification

Errata for the PCI Express Base Specification Revision 4.0

Final Release against Base Revision 4.0
…

Final Release against Base Revision 4.0

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4.x

Errata

PCI Express Architecture Configuration Space Test Specification Revision 4.0, Version 1.0

This document primarily covers PCI Express testing o…

This document primarily covers PCI Express testing of all defined PCI Express device types and RCRBs for the standard Configuration Space mechanisms, registers, and features in Chapter 6 of the PCI Local Bus Specification (Base 3.x or earlier only) and Chapters 7, 9 (Base 4.x or later only), 10 (Base 4.x or later only) of the PCI Express Base Specification (some additional tested registers are described in other specifications that are referenced in the individual test description). This specification does not describe the full set of PCI Express tests for these devices.

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4.x

Specification

PCI Express Architecture Link Layer and Transaction Layer Test Specification Revision 4.0, Version 1.0

This test specification primarily covers testing of …

This test specification primarily covers testing of PCI Express® Device and Port types for compliance with the link layer and transaction layer requirements of the PCI Express Base Specification. Device and Port types that do not have a link (e.g., Root Complex Integrated Endpoints, Root 10 Complex Event Collectors) are not tested under this test specification. While the test environment can accommodate the presence of a Retimer, it will not test the Retimer itself. At this point, this test specification does not describe the full set of PCI Express tests for all link layer or transaction layer requirements.

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4.x

Specification

PCI Express Architecture PHY Test Specification Revision 4.0, Version 1.0

This document provides test descriptions for PCI Exp…

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4.x

Specification

PCI Express M.2™ Specification Revision 3.0, Version 1.2

The M.2 form factor is intended for Mobile Adapters….

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3.x

Specification

PCI Express Base Specification Revision 5.0, Version 1.0 (Change Bar Versions)

There are four informative …

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There are four informative “changebar” versions of the PCI Express Base 5.0 Specification comparing Base 5.0/1.0 to Base 5.0/0.9 and comparing Base 4.0 and Base 5.0. HTML and PDF versions are provided. Both versions are derived from common source material but have different characteristics, and readers may wish to reference both. These documents are non-normative – the NCB PCI Express Base Specification Revision 5.0, Version 1.0 (NCB-PCI_Express_Base_5.0r1.0-2019-05-22.pdf) is the normative version of this specification.

5.x

Specification

PCI Express Base Specification Revision 5.0, Version 1.0

This specification describes the PCI Express archite…

This specification describes the PCI Express architecture, interconnect attributes, fabric management, and the programming interface required to design and build systems and peripherals that are compliant with the PCI Express Specification.

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5.x

Specification

PCI Express M.2 8GT/s Compliance ECN

This proposal introduces 8GT/s electrical compliance…

This proposal introduces 8GT/s electrical compliance details for M.2 based SSDs.

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3.x

ECN

Voltage Indication for PCIe BGA SSD 16×20 ECN

This proposal repurposes five RFU pins in the 16 mm …

This proposal repurposes five RFU pins in the 16 mm x 20 mm BGA ball map to be optionally used for indicating PWR1, PWR2, and PWR3 supply voltage requirements to the Platform.

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3.x

ECN

ACS Enhanced Capabilities ECN

This ECN defines four new services under ACS for Dow…

This ECN defines four new services under ACS for Downstream Ports, primarily to address issues when ACS redirect mechanisms are used to ensure that DMA Requests from Functions under the direct control of VMs are always routed correctly to the Translation Agent in the host. Three of the services provide redirect or blocking of Upstream Memory Requests that target areas not covered by other ACS services. The fourth service enables the blocking of Upstream I/O Requests, addressing a concern with VM-controlled Functions maliciously sending I/O Requests.

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4.x

ECN

OCuLink Memory Map Correction ECN (Clean)

This is a modification of the cable assembly memory …

This is a modification of the cable assembly memory map defined in the OCuLink Memory Map ECN. Some bits contained within the external cable assembly’s memory are modified to allow for cable aggregation.

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3.x

ECN

OCuLink Memory Map Correction ECN (Change Bar)

This is a modification of the cable assembly memory …

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3.x

ECN

ACS Enhanced Capabilities ECN

4.x

ECN

SFF Manufacturing Mode ECN

High Volume Manufacturing (HVM) benefits from the ab…

High Volume Manufacturing (HVM) benefits from the ability to set manufacturing specific SFF8639 Module modes that enable multiplexing of standard connector pins for manufacturing test specific use. This ECR is to define a method to allow the Host to enable Manufacturing Mode on the SFF-8639 Module through the standard interface connector. The Manufacturing Mode solution proposed is consistent with that already approved in SNIA SFFTA-1001 Revision 1.1 for SFF-8639 use.

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3.x

ECN

_HPX and PCIe Completion Timeout related _OSC Enhancements ECN

Changes are requested to be made to Section 4.5.1, _…

Changes are requested to be made to Section 4.5.1, _OSC Interface for PCI Host Bridge Devices and Section 4.5.2.4 Dependencies Between _OSC Control Bits. The changes will enable the Operating System to advertise if it is capable of support _HPX PCI Express Descriptor Setting Record (Type 3) to the firmware. It also enables the Operating System and the Firmware to negotiate ownership of the PCIe Completion Timeout registers.

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3.x

ECN

Downstream Port Containment Related Enhancements ECN

The changes effect the PCI Firmware Specification, R…

The changes effect the PCI Firmware Specification, Revision 3.2 and will enable the Operating System to advertise its Downstream Port containment related capabilities to the firmware. It also enables the Operating System and the Firmware to negotiate ownership of Downstream Port Containment extended capability register block and collaboratively manage Downstream Port Containment events.

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3.x

ECN

Enhanced PCIe Precision Time Measurement (ePTM) ECN

This ECN effects the PCI Express Base Specification,…

This ECN effects the PCI Express Base Specification, Version 4.0. ePTM is an improvement on the existing Precision Time Measurement capability that provides improved detection and handling of error cases. ePTM quickly identifies and resolves errors that may cause clocks to become desynchronized.

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4.x

ECN

1.8V Sideband, Power Loss Notification, USB 2.0, and Higher Power Support ECN

This ECN introduces multiple features for M.2 and af…

This ECN introduces multiple features for M.2 and affects the PCIe M.2 Specification Revision 1.1 and the PCIe BGA SSD 11.5×13 ECN.

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1.x

ECN

Async Hot-Plug Updates ECN

This ECN updates several areas related to hot-plug f…

This ECN updates several areas related to hot-plug functionality, mostly related to Async hot-plug, which is now growing in importance due to its widespread use with NVMe SSDs. All new functionality is optional. This ECN affects the PCIe 4.0 Base Specification.

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4.x

ECN

OCuLink Implementation ECN

Several dimensions included in Chapter 9 of the OCuL…

Several dimensions included in Chapter 9 of the OCuLink 1.0 Specification are repeated from previous chapters. 7 Repeated dimensions have been removed and additional pointers have been added to direct users where to find 8 more information about various OCuLink implementations.

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1.x

ECN

Enabling Multiple Base Addresses per PCI Segment Group ECN

The changes affect the PCI Firmware Specification, R…

The changes affect the PCI Firmware Specification, Revision 3.2 and enable the MCFG table format to allow for multiple memory mapped base address entries, instances of Table 4-3, per single PCI Segment Group.

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3.x

ECN

OCuLink x4 Drawing ECN

Drawings and dimensions for the x4 form factor have …

Drawings and dimensions for the x4 form factor have been corrected and clarified.

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1.x

ECN

Root Complex Event Collector Bus Number Association ECN

4.x

ECN

Root Complex Event Collector Bus Number Association ECN

This ECN enhances Root Complex Event Collectors (RCE…

This ECN enhances Root Complex Event Collectors (RCECs) to allow them to be associated with Devices located on additional Bus numbers.

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4.x

ECN

Root Complex Event Collector Bus Number Association ECN

4.x

ECN

Address Translation Relaxed Ordering ECN

4.x

ECN

Address Translation Relaxed Ordering ECN

This ECN allows Address Translation Requests and Com…

This ECN allows Address Translation Requests and Completions to support the Relaxed Ordering bit, where are currently defined to be Reserved for these types of TLPs. The proposal preserves interoperability with older Translation Agents.

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4.x

ECN

Address Translation Relaxed Ordering ECN

4.x

ECN

OCuLink CPRSNT# Notice ECN

The cable presence (CPRSNT#) signal was incompletely…

The cable presence (CPRSNT#) signal was incompletely and inaccurately specified in the original OCuLink 1.0 specification. The definition for the logic levels of this signal contradicted the active low naming convention. The direction has multiple contradictions.

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1.x

ECN

OCuLink Port and Cable Aggregation ECN

The OCuLink workgroup has received feedback that the…

The OCuLink workgroup has received feedback that the information included in the specification regarding cable/ Port aggregation was unclear, particularly with respect to sideband management. Wording in sections relating to cable/ Port aggregation and sideband management has been reworked to be clearer.

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1.x

ECN

PCI Express SFF-8639 Module Specification, Revision 3.0, Version 1.0

The focus of this specification is on PCI Express (P…

The focus of this specification is on PCI Express (PCIe®) solutions utilizing the SFF-8639 connector interface. Form factors include, but are not limited to, those described in the SFF-8201 Form Factor Drive Dimensions Specification. Other form factors, such as PCI Express CEM are documented in other independent specifications.

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3.x

Specification

OCuLink Power Appendices ECN

The ECN provides clarif

…

The ECN provides clarifications for requirements that affect both systems implementers and cable assembly suppliers. The revisions will save time and confusion for the implementation of the optional external OCuLink cables.

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1.x

ECN

NCTF Ground Ball Definition for PCIe BGA SSD 11.5×13 ECN

This change notice redefines the outer most ring of …

This change notice redefines the outer most ring of ground pins in the 11.5×13 BGA ball map to be redundant ground pins that are non-critical to function (NCTF).NCTF is a new pin definition indicating that while the pins shall continue to be connected to host and device ground, they are redundant such that they allow for mechanical failure but not functional failure.

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1.x

ECN

OCuLink Cable Spec ECN (Change Bar)

The IL/ fitted IL requirements have been clarified….

The IL/ fitted IL requirements have been clarified. The language of this portion of the spec has been reworked to eliminate confusion and provide uniformity in the subsections included in the following document.

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1.x

ECN

OCuLink Cable Spec ECN (Clean)

The IL/ fitted IL requirements have been clarified….

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1.x

ECN

OCuLink Performance Table Change Notice ECN

This is a modification of the connector/cable perfor…

This is a modification of the connector/cable performance tables defined in OCuLink 1.0, Section 6.9 and updated by the OCuLink Server Change ECN. The tables are reorganized to make this section of OCuLink more functional to the end user. Some table entry values are changed.

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1.x

ECN

Errata for the PCI Express® Base Specification Revision 3.1, Single Root I/O Virtualization and Sharing Revision 1.1, Address Translation and Sharing Revision 1.1, and M.2 Specification Revision 1.0

Final Release against Base Revision 3.1a.Subsequent …

Final Release against Base Revision 3.1a.Subsequent Errata will be against Base Revision 4.0

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3.x

Errata

PCIe Link Activation ECN

Link Activation allows software to temporarily disab…

Link Activation allows software to temporarily disable Link power management, enabling the avoidance of the architecturally mandated stall for software-initiated L1 Substate exits.

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4.x

ECN

PCIe Link Activation ECN

4.x

ECN

Add a Second PCIe Lane to Type 1216 SDIO Based LGA Module ECN

The M.2 Type 1216 Land Grid Array (LGA) Connectivity…

The M.2 Type 1216 Land Grid Array (LGA) Connectivity module is modified to add a second PCIe lane. Referring to Figure 99 on page 127

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1.x

ECN

Additional Voltage Value for PWR_1 Rail V0.3 ECN

This proposal adds an additional voltage value to th…

This proposal adds an additional voltage value to the PWR_1 rail in the PCIe BGA SSD 11.5×13 ECR. Table 3 of section 3.4 in the document “PCIe BGA SSD 11.5×13 ECR”, defines the PWR_1 signal as a 3.3V source. This is changed to now also include a 2.5V rail.

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1.x

ECN

_DSM Additions for Runtime Device Power Management

This ECN adds two capabilities by way of adding func…

This ECN adds two capabilities by way of adding functions to the PCI Firmware Spec defined _DSM definition.

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3.x

ECN

OCuLink BP Type ECN (Clean)

The backplane type (BP Type) signal was incompletely…

The backplane type (BP Type) signal was incompletely specified in the original OCuLink 1.0 specification. Table 2-2 now includes a Type of logic used for this signal. A definition is provided for the logic levels of this signal.

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1.x

ECN

OCuLink Wiring Chart ECN (Clean)

a….

a. The connector and cable assembly pinout tables have been revised to show the complete OCuLink pinout assignments in all cases. b. The two left-most columns in the cable pinout tables have been combined for clarity. c. Due to the fact that the pinout tables span multiple pages, P1/P2 designations have been included in the appropriate column titles of the cable pinout tables to make it easier to follow which end of the cable is being addressed on each page in each table.

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1.x

ECN

OCuLink BP Type ECN (Change Bar)

The backplane type (BP Type) signal was incompletely…

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1.x

ECN

OCuLink Wiring Chart ECN (Change Bar)

a….

a. The connector and cable assembly pinout tables have been revised to show the complete
OCuLink pinout assignments in all cases.
b. The two left-most columns in the cable pinout tables have been combined for clarity.
c. Due to the fact that the pinout tables span multiple pages, P1/P2 designations have been
included in the appropriate column titles of the cable pinout tables to make it easier to follow
which end of the cable is being addressed on each page in each table.

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1.x

ECN

PCI Express® Base Specification Revision 4.0, Version 1.0

This specification describes the PCI Express® archit…

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4.x

Specification

PCI Express® Base Specification Revision 4.0, Version 1.0 (Change Bar)

This specification describes the PCI Express® archit…

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4.x

Specification

Native PCIe Enclosure Management ECN

Defines mechanisms for simple storage enclosure mana…

Defines mechanisms for simple storage enclosure management for NVMe SSDs, consistent with established capabilities in the storage ecosystem, with the first version of this capability defining a register interface for LED control. This ECN defines a new PCI Express extended capability called Native PCIe Enclosure Management (NPEM).

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3.x

ECN

Expansion ROM Validation ECN

Provide an optional mechanism to indicate to softwar…

Provide an optional mechanism to indicate to software the results of a hardware validation of Expansion ROM contents.

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4.x

ECN

Expansion ROM Validation ECN

4.x

ECN

PCIe CEM Thermal Reporting ECN

This ECN specifies changes to the PCI Local Bus Spec…

This ECN specifies changes to the PCI Local Bus Specification Revision 3.0 and the PCI Express CEM Specification 3.0. Changes to the PCI Local Bus Specification cover a new VPD encoding and a 32-bit field. Changes to the PCI Express CEM Specification cover a series of graphs used to classify air flow impedance and thermal properties under varying conditions as well as the test figure and process to create these graphs for a given adapter add-in card.

Adapter add-in card types supported by this include all SINGLE-SLOT and DUAL-SLOT PCIe CEM adapter add-in cards without integrated air movers, including standard height adapter add-in cards as well as low-profile adapter add-in cards). Adapter add-in cards with an integrated air mover were not addressed due to the added complication of their integrated air mover in the overall platform’s potential cooling redundancy.

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3.x

ECN

Hierarchy ID Message ECN

Defines a new, optional PCI-SIG Defined Type 1 Vendo…

Defines a new, optional PCI-SIG Defined Type 1 Vendor Defined Message.

This message provides software and/or firmware, running on a Function, additional information to uniquely identify that Function, within a large system or a collection of systems.

When a single system contains multiple PCI Express Hierarchies, this message tells a Function which Hierarchy it resides in. This value, in conjunction with the Routing ID number uniquely identifies a Function within that system.

In clustered system, this message can include a System Globally Unique Identifier (System GUID) for each system. This value, in conjunction with the Hierarchy ID and Routing ID uniquely identifies a Function within that cluster.

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3.x

ECN

Enable PCIe and USB 3.1 Gen1 on M.2 Card Key B ECN

M.2 Key B (WWAN) is modified to enable PCIe and USB …

M.2 Key B (WWAN) is modified to enable PCIe and USB 3.1 Gen1 signals to be simultaneously present on the connector. This enables support for a single SKU M.2 card that supports both PCIe and USB 3.1 Gen1. There are two implementation options enabled:

1. State #14 in the “Socket 2 Add-in Card Configuration Table” is re-defined to indicate an Add-in Card built to the PCI Express M.2 Specification, Revision 1.1 or later where both PCIe and USB 3.1 Gen1 are both present on the connector. The choice of Port Configuration is vendor defined. This enables the host to unambiguously determine that PCIe and USB 3.1 Gen1 are present on the connector.

2. States #4, 5, 6, 7 in the “Socket 2 Add-in Card Configuration Table” are re-defined to indicate that in addition to USB 3.1 Gen1, PCIe may be present on the connector. This definition was used by M.2 cards built to the PCI Express M.2 Specification, Revision 1.0 (USB 3.1 Gen1 on connector; PCIe is “no connect”). This definition is now also permitted to be used by M.2 cards built to PCI Express M.2 Specification, Revision 1.1 or later to indicate that PCIe and USB 3.1 Gen1 are both present on the connector. This allows GPIO port configurations to remain consistent with all other existing states.

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1.x

ECN

Flattening Portal Bridge (FPB) ECN

This ECR is intended to address a class of issues wi…

This ECR is intended to address a class of issues with PCI/PCIe architecture that relate to resource allocation inefficiency. To explain this, first we must define some terms:

Static use cases, refer to scenarios where resources are allocated at system boot and then typically not changed again
Dynamic use cases, refer to scenarios where run-time resource rebalancing (allocation of new resources, freeing of resources no longer needed) is required, due to hot add/remove, or by other needs.

In the Static cases there are limits on the size of hierarchies and number of Endpoints due to the Bus & Device Number “waste” caused by the PCI/PCIe architectural definition for Switches, and by the requirement that Downstream Ports associate an entire Bus Number with their Link. This proposal addresses this class of problems by “flattening” the use of Routing IDs so that Switches and Downstream Ports are able to make more efficient use of the available space.

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3.x

ECN

PCIe BGA SSD 11.5×13 ECN

This proposal adds a new 11.5 mm x 13 mm PCIe BGA SS…

This proposal adds a new 11.5 mm x 13 mm PCIe BGA SSD form factor to the M.2 v1.1 specification.

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1.x

ECN

OCuLink Skew

A PCI Express Receiver is required to tolerate 6 ns …

A PCI Express Receiver is required to tolerate 6 ns of lane to lane skew when operating at 8.0 GT/s. The PCI Express OCuLink Specification allowed the cable assembly to consume the entire budget. The Transmitter and traces routing to the OCuLink connector need some of this budget. The PCI Express Card Electromechanical Specification Revision 3.0 assigns 1.6 ns to the total interconnect lane to lane skew budget.

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1.x

ECN

PCI Express M.2 Specification Revision 1.1

The M.2 form factor is intended for Mobile Adapters….

The M.2 form factor is intended for Mobile Adapters. The M.2 is a natural transition from the Mini 3 Card and Half-Mini Card (refer to the PCI Express Mini CEM Specification) to a smaller form factor in 4 both size and volume. The M.2 is a family of form factors that enables expansion, contraction, and 5 higher integration of functions onto a single form factor module solution.

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1.x

Specification

PCI Express M.2 Specification Revision 1.1 with Change Bar

The M.2 form factor is intended for Mobile Adapters….

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1.x

Specification

PCI Express® Mini Card Electromechanical Specification Revision 2.1

This specification defines an implementation for sma…

This specification defines an implementation for small form factor PCI Express cards. The specification uses a qualified subset of the same signal protocol, electrical definitions, and configuration definitions as the PCI Express Base Specification, Revision 2.0. Where this specification 5 does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.

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2.x

Specification

PCI Express® Mini Card Electromechanical Specification Revision 2.1 with Change Bar

This specification defines an implementation for sma…

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2.x

Specification

OCuLink Memory Map Change

This is a modification of the cable assembly memory …

This is a modification of the cable assembly memory map defined in OCuLink 1.0, Appendix A. The addresses for the data bytes contained within the external cable assembly’s memory will be reorganized. In addition, some data in these fields are modified.

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1.x

ECN

OCuLink Server Change

Table 6-12 and Table 6-13 in Section 6.9 are modifie…

Table 6-12 and Table 6-13 in Section 6.9 are modified to reflect connector requirements for server/datacenter segment. In addition, this proposal also reflects a clarification in the Introduction text, Section 1 to include the server/datacenter market segment.

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1.x

ECN

VF Resizable BARs ECN

Similar to, and based on, the Resizable BAR and Expa…

Similar to, and based on, the Resizable BAR and Expanded Resizable BAR ECNs, this optional ECN adds a capability for PFs to be able to resize their VF BARs. This ECN is written with the expectation that the Expanded Resizable BAR ECN will have been released prior to this ECN’s release. This ECN supports all of the BAR sizes defined by both the Resizable BAR and Expanded Resizable BAR ECNs.

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3.x

ECN

SR-IOV Table Updates ECN

Update SR-IOV specification to reflect current PCI C…

Update SR-IOV specification to reflect current PCI Code and ID Assignment Specification, regarding PCI capabilities and PCI-E extended capabilities. Clarify the requirements for VFs regarding the other Capabilities added by ECNs that should have updated the SR-IOV specification but did not.

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3.x

ECN

Extended Message Data for MSI ECN

MSI is enhanced to include an Extended Message Data …

MSI is enhanced to include an Extended Message Data Field for the function generating the interrupt. The MSI Capability Structure is modified to enable the new feature to be enabled/disabled; and a new Extended Message Data Field to be configured. This change only applies to MSI and not MSI-X.

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3.x

ECN

Expanded Resizable BARs ECN

The Resizable BAR capability currently allows BARs o…

The Resizable BAR capability currently allows BARs of up to 512 GB (239), which allows address bits <38:0> to be passed into an Endpoint. This proposal extends resizable BARs to up to 263 bits, which supports the entire address space.

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3.x

ECN

M.2 SSIC Eye Limits Definition ECN

Definition of electrical eye limits (Eye Height and …

Definition of electrical eye limits (Eye Height and Eye Width) at the M.2 connector for SSIC host and device transmitter is proposed to be added in the specification.

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3.x

ECN

Root Complex Integrated Endpoints and IOV Updates

This ECN implements a variety of spec modifications …

This ECN implements a variety of spec modifications intended to correct inconsistencies related to, and to support more consistent implementation of, Root Complex integrated Endpoints, with a particular focus on issues relating to Single Root IO Virtualization (SR-IOV).

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3.x

ECN

PCI Express Base Specification Revision 3.1a

This specification describes the PCI Express® archit…

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3.x

Specification

PCI Express Base Specification Revision 3.1a with Change Bar

This specification describes the PCI Express® archit…

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3.x

Specification

Emergency Power Reduction Mechanism with PWRBRK Signal ECN

This ECN defines two sets of related changes to supp…

This ECN defines two sets of related changes to support an Emergency Power Reduction mechanism and to provide software visibility for this mechanism:
1. The Card Electromechanical Specification is updated to define an optional Emergency Power Reduction mechanism using RSVD pin B30.
2. The PCI Express Base Specification is updated to define an optional mechanism to indicate support for Emergency Power Reduction and to provide visibility as to the power reduction status of a Device.

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3.x

ECN

Supporting PCIe and SATA BGA form factor for SSDs ECN

This ECN is intended to define a new form-factor and…

This ECN is intended to define a new form-factor and electrical pinout to the M.2 family. This proposal will allow PCIe and SATA to be delivered using a BGA package, expanding the use of the PCIe and SATA protocols in small form-factor applications. The new BGA pinout content is based on the Socket 3 Key-M definitions. BGA pinout supports additional pins than defined for Socket-3, for soldered-down form-factors.

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1.x

ECN

PCI Express® OCuLink Specification Revision 1.0

This document is a companion Specification to the PC…

This document is a companion Specification to the PCI Express Base Specification and other PCI Express® 2 documents listed in Section 1.1. The primary focus of the PCI Express OCuLink Specification is the implementation 3 of internal and external small form factor PCI Express® connectors and cables optimized for the client and mobile 4 market segments. This Specification discusses cabling and connector requirements to meet the 8.0 GT/s signaling 5 needs in the PCI Express Base Specification. 6
No assumptions are made regarding the implementation of PCI Express compliant components on either side of 7 the Link; such components are addressed in other PCI Express Specifications.

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1.x

Specification

Designated Vendor-Specific Extended Capability ECN

Define a Vendor-Specific Extended Capability that is…

Define a Vendor-Specific Extended Capability that is not tied to the Vendor ID of the Component 5 or Function. This capability includes a Vendor ID that determines the interpretation of the remainder of the capability. It is otherwise similar to the existing Vendor-Specific Extended Capability.

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3.x

ECN

WWAN Key C Definition

This ECR describes the necessary changes to enable a…

This ECR describes the necessary changes to enable a new WWAN Key C definition to be included as an addition to the existing spec. The intent is to create a dedicated WWAN socket Key and pinout definition. This new pinout definition will be focused on WWAN specific interfaces and needs.

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1.x

ECN

PCI Firmware Specification Revision 3.2

This document describes the hardware independent fir…

This document describes the hardware independent firmware interface for managing PCI, PCI-X, and PCI Express systems in a host computer.

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3.x

Specification

M.2 2242 WWAN Module

Add 2242 form factor for WWAN modules using Socket 2…

Add 2242 form factor for WWAN modules using Socket 2 with key B.

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1.x

ECN

Power-up requirements for PCIe side bands in a Vbat powered system

In ECN “Power-up requirements for PCIe side bands (P…

In ECN “Power-up requirements for PCIe side bands (PERST#, etc.)” – submitted by Dave Landsman and Ramdas Kachare – section 3.1.3.2.1 is redefined to provide a more realistic timing model for reset.

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1.x

ECN

Tx Blanking and SYSCLK on Socket 1 Related Pinouts

The proposed change is to include 2 GNSS Aiding sign…

The proposed change is to include 2 GNSS Aiding signals, that we already have allocated in the Type 1216 pinout, to the Socket 1 Key E pinout and Type 2226/3026 pinout. Due to lack of free pins in the Key E pinout, it is proposed to define 2 SDIO Input signals as dual functional pins. They would be defined with their original SDIO functionality along with and alternate GNSS Aiding signals functionality to enable a GNSS solution on Type 2230 solutions on Socket 1 Key E solutions. The GNSS signals to be added are the Tx Blanking and SYSCLK signals and it is suggested to overlay them on the SDIO RESET# and SDIO CLK respectively which are also inputs. In this way it is less likely to cause a potential contention.

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1.x

ECN

M.2 COEX Signal Definition – UART

Definition of two of the three COEX pins as a UART T…

Definition of two of the three COEX pins as a UART Tx/Rx communication path between Socket 1 and Socket 2 in favor of WWAN ßà Connectivity coexistence. The intent is to definitively define the location of the source and sink sides of the signal path.

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1.x

ECN

Transition of NFC Signals from 3.3V to 1.8V

The proposed change is to change the current voltage…

The proposed change is to change the current voltage level of the NFC related signals (I2C DATA, I2C CLK and ALERT#) on the Connectivity pinouts and definitions from 3.3V to 1.8V signal level to better align with future platforms operating signal levels typical in the industry.

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1.x

ECN

Extension Devices

Provide specification for Physical Layer protocol aw…

Provide specification for Physical Layer protocol aware Retimers for PCI Express 3.0/3.1.

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3.x

ECN

Power-up requirements for PCIe side bands (PERST#, etc.)

Section 3.1.3.2.1 is redefined to provide a more rea…

Section 3.1.3.2.1 is redefined to provide a more realistic timing model for reset.

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1.x

ECN

M.2 Signal Definition – Audio & ANTCTL Functions

Definition of the four Audio pins to provide definit…

Definition of the four Audio pins to provide definitive functions assigned to each pin of the Audio interface.

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1.x

ECN

SMBus interface for SSD Socket 2 and Socket 3

SMBus interface signals are included in sections 3.2…

SMBus interface signals are included in sections 3.2 and 3.3 and related minor clarifications added to sections 1.2, 1.3, 2.2, 4.1, 4.2, 5.2.2, and 5.3.

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1.x

ECN

Add USB 3.0 to the Mini Card

Mobile broadband peak data rates continue to increas…

Mobile broadband peak data rates continue to increase. With LTE category 5, USB 2.0 will not meet the performance requirements. LTE category 5 peak data rates are 320 Mbps downlink; 75 Mbps uplink. Most USB 2.0 implementations achieve a maximum of about 240 Mbps throughput. Looking longer term, the ITU has set a target of 1 Gbits/s for low mobility applications for IMT Advanced.

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2.x

ECN

NOP DLLP

This ECN accomplishes two housekeeping tasks associa…

This ECN accomplishes two housekeeping tasks associated with DLLP encoding.

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3.x

ECN

Separate Refclk Independent SSC Architecture (SRIS) JTOL and SSC Profile Requirements

Modifies specifications to provide revised JTOL curv…

Modifies specifications to provide revised JTOL curve for SRIS mode and provides additional frequency domain constraint of SSC profile jitter on reference clocks.

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3.x

ECN

Tighten Mini Card Power Rail Voltage Tolerance

Modify the Mini Card specification to tighten the po…

Modify the Mini Card specification to tighten the power rail voltage tolerance.

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2.x

ECN

PLL Bandwidth Test Limits

Modifies the limits used by the PLL bandwidth test t…

Modifies the limits used by the PLL bandwidth test to allow guardband for a single PLL test solution to be used at PCI-SIG compliance workshops without impacting pass/fail results for member companies.

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3.x

ECN

PCI Express M.2 Specification Revision 1.0

The M.2 form factor is used for Mobile Add-In cards….

The M.2 form factor is used for Mobile Add-In cards. The M.2 is a natural transition from the Mini Card and Half-Mini Card to a smaller form factor in both size and volume. The M.2 is a family of form factors that will enable expansion, contraction, and higher integration of functions onto a single form factor module solution.

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1.x

Specification

PCIe Hot Plug

This ECN affects the PCI Firmware Specification v3.1…

This ECN affects the PCI Firmware Specification v3.1 and allows certain errors to be suppressed by platform if software stack ensured error containment. Also removes the implementation note in section 4.5.2.4 which is not representative of OS behavior.

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3.x

ECN

Readiness Notifications (RN)

Defines mechanisms to reduce the time software need…

Defines mechanisms to reduce the time software needs to wait before issuing a Configuration Request to a PCIe Function or RC-integrated PCI Function following power on, reset, or power state transitions.

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3.x

ECN

PCI Express Card Electromechanical Specification Revision 3.0

This specification is a companion for the PCI Expres…

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This specification is a companion for the PCI Express Base Specification, Revision 3.0. Its primary focus is the implementation of an evolutionary strategy with the current PCI™ desktop/server mechanical and electrical specifications. Access Test Channel S-Parameters

3.x

Specification

PCI Express Architecture Platform Init/Config Revision 3.0

This test specification primarily covers tests of PC…

This test specification primarily covers tests of PCI Express platform firmware for features critical to PCI Express. This specification does not include the complete set of tests for a PCI Express System.

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3.x

Specification

PCI Express Architecture PHY Test Specification Revision 3.0

This document provides test descriptions for PCI Exp…

This document provides test descriptions for PCI Express electrical testing. It is relevant for anyone building add-in cards or system boards to the PCI Express Card Electromechanical Specification 3.0. This specification does not describe the full set of PCI Express tests and assertions for these devices.

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3.x

Specification

PCI Express Architecture Configuration Space Test Specification Revision 3.0

This document primarily covers PCI Express testing o…

This document primarily covers PCI Express testing of all defined PCI Express Device Types and RCRBs for the standard Configuration Space mechanisms, registers, and features in Chapter 6 of the PCI Local Bus Specification and Chapter 7 of the PCI Express Base Specification (some additional tested registers are described in other specifications that are referenced in the individual test description).

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3.x

Specification

PCI Express® Architecture Link Layer and Transaction Layer Test Specification Revision 3.0

This test specification primarily covers testing of …

This test specification primarily covers testing of PCI Express Device and Port types for compliance with the link layer and transaction layer requirements of the PCI Express Base Specification. Device and Port types that do not have a link (e.g., Root Complex Integrated Endpoints, Root Complex Event Collectors) are not tested under this test specification. At this point, this test specification does not describe the full set of PCI Express tests for all link layer or transaction layer requirements.

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3.x

Specification

L1 PM Substates with CLKREQ, Revision 1.0a

This ECR defines an optional mechanism, that establ…

This ECR defines an optional mechanism, that establishes, depending on implementation, one or more substates of the L1 Link state, which allow for dramatically lower idle power, including near complete removal of power for high speed circuits.

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3.x

ECN

M-PCIe

This ECR defines a new logical layer mapping of PCI …

This ECR defines a new logical layer mapping of PCI Express over the MIPI Alliance M-PHY1 specification.

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3.x

ECN

Precision Time Measurement (PTM), Revision 1.0a

Defines an optional-normative Precision Time Measure…

Defines an optional-normative Precision Time Measurement (PTM) capability. To accomplish this, Precision Time Measurement defines a new protocol of timing measurement/synchronization messages and a new capability structure.

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3.x

ECN

Separate Refclk Independent SSC Architecture (SRIS)

Provide specifications to enable separate Refclk wit…

Provide specifications to enable separate Refclk with Independent Spread Spectrum Clocking (SSC) architecture.

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3.x

ECN

Seasim Software Package

The PCI Express 3.0 describes a method to simulate 8…

The PCI Express 3.0 describes a method to simulate 8GT/s channel compliance using a statistical data eye simulator. To help members perform this simulation, a free open source tool called Seasim is provided below. This tool has been tested by members of the Electrical Working Group on multiple channels and has reached version 0.54 which should be useful for members designing 8GT/s systems.

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3.x

Specification

Change Root Complex Event Collector Class Code

Change the Sub-Class assignment for Root Complex Eve…

Change the Sub-Class assignment for Root Complex Event Collector from 06h to 07h.

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3.x

ECN

Enhanced DPC (eDPC)

This optional normative ECN defines enhancements to …

This optional normative ECN defines enhancements to the Downstream Port Containment (DPC) ECN, an ECN that enabled automatic disabling of the Link below a Downstream Port following an uncorrectable error. The DPC ECN defined functionality for both Switch Downstream Ports and Root Ports. This ECN mostly defines functionality that is specific to Root Ports, functionality referred to as “RP Extensions for DPC”.

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3.x

ECN

PCI Express Architecture Configuration Space Test Specification Revision 2.0a

This document primarily covers PCI Express testing o…

This document primarily covers PCI Express testing of root complexes, switches, bridges, and endpoints for the standard configuration mechanisms, registers, and features in Chapter 7 of the PCI Express Base Specification, Revision 2.0. This specification does not describe the full set of PCI Express tests and assertions for these devices.

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2.x

Specification

PCI Express Architecture Configuration Space Test Specification Revision 2.0a with Change Bar

This document primarily covers PCI Express testing o…

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2.x

Specification

PCI Express Architecture Link Layer Test Specification Revision 2.0

This test specification primarily covers testing of …

This test specification primarily covers testing of all PCI Express Port types for compliance with the link layer requirements in Chapter 3 of the PCI Express Base Specification. At this point, this specification does not describe the full set of PCI Express tests for all link layer requirements. Going forward, as the testing gets mature, it is expected that more tests may be added as deemed necessary.

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2.x

Specification

PCI Express Architecture PHY Test Specification Revision 2.0

This document provides test descriptions for PCI Exp…

This document provides test descriptions for PCI Express electrical testing. It is relevant for anyone building add-in cards or system boards to the PCI Express Card Electromechanical Specification, Revision 2.0. This specification does not describe the full set of PCI Express tests and assertions for these devices.

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2.x

Specification

PCI Express External Cabling Specification Revision 2.0

This is a companion specification to the PCI Express…

This is a companion specification to the PCI Express Base Specification. Its primary focus is the implementation of cabled PCI Express®. The discussions are confined to copper cabling and their connector requirements to meet the PCI Express signaling needs at 5.0 GT/s. No assumptions are made regarding the implementation of PCI Express compliant Subsystems on either side of the cabled Link; e.g., PCI Express Card Electromechanical (CEM), ExpressCard5 ™, ExpressModule™, PXI Express™, system board, or any other form factor. Such form factors are covered in other separate specifications.

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2.x

Specification

PCI Express External Cabling Specification Revision 2.0 with Change Bar

This is a companion specification to the PCI Express…

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2.x

Specification

Combined Antenna Tuning/Coexistence Signal ECR

Modify the PCI Express Mini Card specification to de…

Modify the PCI Express Mini Card specification to define a new interface for tunable antennas. Modify the PCI Express Mini Card specification to enable existing coexistence signals to operate simultaneously with new tuneable antenna control signals.

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2.x

ECN

PCI Express Mini Card Electromechanical Specification Revision 2.0 with Change Bar

This specification defines an implementation for sma…

This specification defines an implementation for small form factor PCI Express cards. The specification uses a qualified sub-set of the same signal protocol, electrical definitions, and configuration definitions as the PCI Express Base Specification, Revision 2.0. Where this specification does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.

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2.x

Specification

PCI Express Mini Card Electromechanical Specification Revision 2.0

This specification defines an implementation for sma…

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2.x

Specification

Downstream Port Containment (DPC)

This ECN defines a new error containment mechanism f…

This ECN defines a new error containment mechanism for Downstream Ports as well as minor enhancements that improve asynchronous card removal. Downstream Port Containment (DPC) is the automatic disabling of the Link below a Downstream Port following an uncorrectable error. This prevents the potential spread of data corruption (all TLPs subsequent to the error are prevented from propagating either Upstream or Downstream) and enables error recovery if supported by software.

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3.x

ECN

Lightweight Notification (LN) Protocol

This optional normative ECN defines a simple protoco…

This optional normative ECN defines a simple protocol where a device can register interest in one or more cachelines in host memory, and later be notified via a hardware mechanism when any registered cachelines are updated.

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3.x

ECN

8.0 GT/s Receiver Impedance

Receivers that operate at 8.0 GT/s with an impedance…

Receivers that operate at 8.0 GT/s with an impedance other than the range defined by the ZRX-DC parameter for 2.5 GT/s (40-60 Ohms) must meet additional behavior requirements in the following LTSSM states: Polling, Rx_L0s, L1, L2, and Disabled.

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3.x

ECN

PASID Translation

The Process Address Space ID (PASID) ECN to the Base…

The Process Address Space ID (PASID) ECN to the Base PCI Express Specification defines the PASID TLP Prefix. This companion ECN is optional normative and defines PASID TLP Prefix usage rules for ATS and PRI.

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1.x

ECN

Process Address Space ID (PASID)

This optional normative ECN defines an End-End TLP P…

This optional normative ECN defines an End-End TLP Prefix for conveying additional attributes associated with a request. The PASID TLP Prefix is an End-End TLP Prefix as defined in the PCI Express Base Specification. Routing elements that support End-End TLP Prefixes (i.e. have the End-End TLP Prefix Supported bit Set in the Device Capabilities 2 register) can correctly forward TLPs containing a PASID TLP Prefix.

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1.x

ECN

PCI Firmware Specification Revision 3.1

This document describes the hardware independent fir…

This document describes the hardware independent firmware interface for managing PCI™, PCI-X, and PCI Express® systems in a host computer.

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3.x

Specification

PCI Express Base Specification Revision 3.0 with Change Bar

This specification describes the PCI Express® archit…

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3.x

Specification

PCI Express Base Specification Revision 3.0

This specification describes the PCI Express® archit…

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3.x

Specification

REF CLK Delayed from CLKREQ# Assertion

This ECR requests making a change to the CLKREQ# ass…

This ECR requests making a change to the CLKREQ# asserted low to clock active timing when latency tolerance reporting is supported and enabled for the function. The change would be to allow this specified value to exceed 400ns up to a limit consistent with the latency value established by the Latency Tolerance Reporting (LTR) mechanism.

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1.x

ECN

Protocol Multiplexing

This involves a minor upward compatible change in Ch…

This involves a minor upward compatible change in Chapter 3, Chapter 4 and a new Appendix T.

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3.x

ECN

End-End TLP Prefix Changes for RCs

This change allows for all Root Ports with the End-…

This change allows for all Root Ports with the End-End TLP Prefix Supported bit Set to have different values for the Max End-End TLP Prefixes field in the Device Capabilities 2 register. It also changes and clarifies error handling for a Root Port receiving a TLP with more End-End TLP Prefixes than it supports.

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3.x

ECN

Second Wireless Disable Pin

This ECN is for the functional addition of a second …

This ECN is for the functional addition of a second wireless disable signal (W_DISABLE2#) as a new definition of Pin 51 (Reserved). When this optional second wireless disable signal is not implemented by the system, the original intent of a single wireless disable signal disabling all radios on the add-in card when asserted is still required.

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1.x

ECN

ACPI Additions for ASPM, OBFF, LTR ECNs

A number of PCIe base specifications ECNs have been …

A number of PCIe base specifications ECNs have been approved that require software support. In some cases, platform firmware needs to know if the OS running supports certain features, or the OS needs to be able to request control of certain features from platform firmware. In other cases, the OS needs to know information about the platform that cannot be discovered through PCI enumeration, and ACPI must be used to supply the additional information.

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3.x

ECN

Single Root I/O Virtualization and Sharing Specification Revision 1.1

The purpose of this document is to specify PCI™ I/O …

The purpose of this document is to specify PCI™ I/O virtualization and sharing technology. The specification is focused on single root topologies; e.g., a single computer that supports virtualization technology.

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1.x

Specification

Single Root I/O Virtualization and Sharing Specification Revision 1.1 with Change Bar

The purpose of this document is to specify PCI™ I/O …

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1.x

Specification

CEM Support Power

ECR covers proposed modification of Section 4.2 Pow…

ECR covers proposed modification of Section 4.2 Power Consumption within the CEM Specification version 2.0.

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2.x

ECN

ASPM Optionality

Prior to this ECN, all PCIe external Links were requ…

Prior to this ECN, all PCIe external Links were required to support ASPM L0s. This ECN changes the Base Specification to permit ASPM L0s support to be optional unless the applicable formfactor specification explicitly requires it.

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2.x

ECN

Optimized Buffer Flush/Fill

This ECR proposes to add a new mechanism for platfor…

This ECR proposes to add a new mechanism for platform central resource (RC) power state information to be communicated to Devices. This mechanism enables Optimized Buffer Flush/Fill (OBFF) by allowing the platform to indicate optimal windows for device bus mastering & interrupt activity. Devices can use internal buffering to shape traffic to fit into these optimal windows, reducing platform power impact.

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2.x

ECN

PCI Express Base Specification Revision 2.1

This specification describes the PCI Express® archit…

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2.x

Specification

PCI Express Base Specification Revision 2.1 with Change Bar

This specification describes the PCI Express® archit…

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2.x

Specification

Address Translation Services Revision 1.1

This specification describes the extensions required…

This specification describes the extensions required to allow PCI Express Devices to interact with an address translation agent (TA) in or above a Root Complex (RC) to enable translations of DMA addresses to be cached in the Device. The purpose of having an Address Translation Cache (ATC) in a Device is to minimize latency and to provide a scalable distributed caching solution that will improve I/O performance while alleviating TA resource pressure. This specification must be used in conjunction with the PCI Express Base Specification, Revision 1.1, and associated ECNs.

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1.x

Specification

TLP Prefix

Emerging usage model trends indicate a requirement f…

Emerging usage model trends indicate a requirement for increase in header size fields to provide additional information than what can be accommodated in currently defined TLP header sizes. The TLP Prefix mechanism extends the header size by adding DWORDS to the front of headers that carry additional information.

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2.x

ECN

System Board Eye Height Specification Update

This ECN modifies the system board transmitter path …

This ECN modifies the system board transmitter path requirements (VTXS and VTXS_d) at 5 GT/s. As a consequence the minimum requirements for the add-in card receiver path sensitivity at 5 GT/s are also updated.

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2.x

ECN

TLP Processing Hints

This optional normative ECR defines a mechanism by w…

This optional normative ECR defines a mechanism by which a Requester can provide hints on a per transaction basis to facilitate optimized processing of transactions that target Memory Space. The architected mechanisms may be used to enable association of system processing resources (e.g. caches) with the processing of Requests from specific Functions or enable optimized system specific (e.g. system interconnect and Memory) processing of Requests.

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2.x

ECN

Extended Tag Enable Default

The change allows a Function to use Extended Tag fie…

The change allows a Function to use Extended Tag fields (256 unique tag values) by default; this is done by allowing the Extended Tag Enable control field to be set by default.

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2.x

ECN

PCI Express Architecture Configuration Space Test Specification Revision 2.0

This document primarily covers PCI Express testing o…

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2.x

Specification

Latency Tolerance Reporting

This ECR proposes to add a new mechanism for Endpoin…

This ECR proposes to add a new mechanism for Endpoints to report their service latency requirements for Memory Reads and Writes to the Root Complex such that central platform resources (such as main memory, RC internal interconnects, snoop resources, and other resources associated with the RC) can be power managed without impacting Endpoint functionality and performance.

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2.x

ECN

PCI Express Architecture Transaction Layer Test Specification Revision 2.0

This document contains a list of Test Assertions and…

This document contains a list of Test Assertions and a set of Test Definitions pertaining to the Transaction Layer. Assertions are statements of spec requirements which are measured by the algorithm details as specified in the Test Definitions. “Basic Functional Tests” are Test Algorithms which perform basic tests for key elements of Transaction Layer device functionality. This document does not describe a full set of PCI Express tests and assertions and is in no way intended to measure products for full design validation. Tests described here should be viewed as tools to checkpoint the result of product validation – not as a replacement for that effort.

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2.x

Specification

ID-Based Ordering

This ECN proposes to add a new ordering attribute wh…

This ECN proposes to add a new ordering attribute which devices may optionally support to provide enhanced performance for certain types of workloads and traffic patterns. The new ordering attribute relaxes ordering requirements between unrelated traffic by comparing the Requester/Completer IDs of the associated TLPs.

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2.x

ECN

Dynamic Power Allocation

DPA (Dynamic Power Allocation) extends existing PCIe…

DPA (Dynamic Power Allocation) extends existing PCIe device power management to provide active (D0) device power management substates for appropriate devices, while comprehending existing PCIe PM Capabilities including PCI-PM and Power Budgeting.

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2.x

ECN

Multi-Root I/O Virtualization and Sharing Specification Revision 1.0

The purpose of this document is to specify PCI® I/O …

The purpose of this document is to specify PCI® I/O virtualization and sharing technology. The specification is focused on multi-root topologies; e.g., a server blade enclosure that uses a PCI Express® Switch-based topology to connect server blades to PCI Express Devices or PCI Express to-PCI Bridges and enable the leaf Devices to be serially or simultaneously shared by one or more System Images (SI). Unlike the Single Root IOV environment, independent SI may execute on disparate processing components such as independent server blades.

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1.x

Specification

Multicast

This optional normative ECN adds Multicast functiona…

This optional normative ECN adds Multicast functionality to PCI Express by means of an Extended Capability structure for applicable Functions in Root Complexes, Switches, and components with Endpoints. The Capability structure defines how Multicast TLPs are identified and routed. It also provides means for checking and enforcing send permission with Function-level granularity. The ECN identifies Multicast errors and adds an MC Blocked TLP error to AER for reporting those errors.

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2.x

ECN

Internal Error Reporting

PCI Express (PCIe) defines error signaling and loggi…

PCI Express (PCIe) defines error signaling and logging mechanisms for errors that occur on a PCIe interface and for errors that occur on behalf of transactions initiated on PCIe. It does not define error signaling and logging mechanisms for errors that occur within a component or are unrelated to a particular PCIe transaction.

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2.x

ECN

Resizable BAR Capability

This optional ECN adds a capability for Functions wi…

This optional ECN adds a capability for Functions with BARs to report various options for sizes of their memory mapped resources that will operate properly. Also added is an ability for software to program the size to configure the BAR to.

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2.x

ECN

Atomic Operations

This optional normative ECN defines 3 new PCIe trans…

This optional normative ECN defines 3 new PCIe transactions, each of which carries out a specific Atomic Operation (“AtomicOp”) on a target location in Memory Space. The 3 AtomicOps are FetchAdd (Fetch and Add), Swap (Unconditional Swap), and CAS (Compare and Swap). FetchAdd and Swap support operand sizes of 32 and 64 bits. CAS supports operand sizes of 32, 64, and 128 bits.

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2.x

ECN

PCI Express® 225 W/300 W High Power Card Electromechanical Specification Revision 1.0

The main objective of this specification is to suppo…

The main objective of this specification is to support PCI Express® add-in cards that require higher power than specified in the PCI Express Card Electromechanical Specification and the PCI Express x16 Graphics 150W-ATX Specification.

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1.x

Specification

PCI Express Mini Card Electromechanical Specification Revision 1.2

This specification defines an implementation for sma…

This specification defines an implementation for small form factor PCI Express cards. The specification uses a qualified sub-set of the same signal protocol, electrical definitions, and configuration definitions as the PCI Express Base Specification, Revision 1.1. Where this specification does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.

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1.x

Specification

PCI Express Mini Card Electromechanical Specification Revision 1.2 with Change Bar

This specification defines an implementation for sma…

This specification defines an implementation for small form factor PCI Express cards. The specification uses a qualified sub-set of the same signal protocol, electrical definitions, and configuration definitions as the PCI Express Base Specification, Revision 1.1. Where this specification does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.

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1.x

Specification

Single Root I/O Virtualization and Sharing Specification Revision 1.0

The purpose of this document is to specify PCI™ I/O …

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1.x

Specification

Alternative Routing-ID Interpretation (ARI)

For virtualized and non-virtualized environments, a …

For virtualized and non-virtualized environments, a number of PCI-SIG member companies have requested that the current constraints on number of Functions allowed per multi-Function Device be increased to accommodate the needs of next generation I/O implementations. This ECR specifies a new method to interpret the Device Number and Function Number fields within Routing IDs, Requester IDs, and Completer IDs, thereby increasing the number of Functions that can be supported by a single Device.

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2.x

ECN

PCI Express Card Electromechanical Specification Revision 2.0 with Change Bar

This specification is a companion for the PCI Expres…

This specification is a companion for the PCI Express Base Specification, Revision 2.0. Its primary focus is the implementation of an evolutionary strategy with the current PCI™ desktop/server mechanical and electrical specifications. The discussions are confined to ATX or ATX-based form factors. Other form factors, such as PCI Express® Mini Card are covered in other separate specifications.

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2.x

Specification

PCI Express Card Electromechanical Specification Revision 2.0

This specification is a companion for the PCI Expres…

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2.x

Specification

Address Translation Services Revision 1.0

This specification describes the extensions required…

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1.x

Specification

PCI Express External Cabling Specification Revision 1.0

This is a companion specification to the PCI Express…

This is a companion specification to the PCI Express Base Specification. Its primary focus is the implementation of cabled PCI Express®. The discussions are confined to copper cabling and their connector requirements to meet the PCI Express signaling needs at 2.5 GT/s. No assumptions are made regarding the implementation of PCI Express compliant Subsystems on either side of the cabled Link; e.g., PCI Express Card Electromechanical (CEM), ExpressCard™, ExpressModule™, PXI Express™, system board, or any other form factor. Such form factors are covered in other separate specifications.

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1.x

Specification

PCI Express Base Specification Revision 2.0

This specification describes the PCI Express® archit…

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2.x

Specification

PCI Option ROM CLP

This ECN rectifies the differences between the DMTF …

This ECN rectifies the differences between the DMTF SM CLP Specification and its supporting documents with the current PCI Firmware 3.0 Specification. Also, it clarifies the supporting documents required for successfully implementing CLP in an X86 PCI FW 3.0 compatible option ROM.

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3.x

ECN

PCI_OSC Clarifications

This ECN attempts to make clarifications such that t…

This ECN attempts to make clarifications such that the system firmware and multiple operating systems can have the same interpretation of the specification and work interoperably.

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3.x

ECN

Ignore PCI Boot Configuration_DSM Function

This ECN adds a function to the _DSM Definitions for…

This ECN adds a function to the _DSM Definitions for PCI to provide an indication to an operating system that it can ignore the PCI boot configuration setup by the firmware during system initialization.

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3.x

ECN

PCI Firmware Specification Revision 3.0

This document describes the hardware independent fir…

This document describes the hardware independent firmware interface for managing PCI, PCI-X, and PCI Express™ systems in a host computer.

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3.x

Specification

PCI Express Card Electromechanical Specification Revision 1.1

This specification is a companion for the PCI Expres…

This specification is a companion for the PCI Express Base Specification, Revision 1.1. Its primary focus is the implementation of an evolutionary strategy with the current PCI desktop/server mechanical and electrical specifications. The discussions are confined to ATX or ATX-based form factors. Other form factors, such as PCI Express Mini Card are covered in other separate specifications.

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1.x

Specification

PCI Express Card Electromechanical Specification Revision 1.1 with Change Bar

This specification is a companion for the PCI Expres…

show less

1.x

Specification

PCI Express Base Specification Revision 1.1 with Change Bar

This specification describes the PCI Express archite…

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1.x

Specification

PCI Express Base Specification Revision 1.1

This specification describes the PCI Express archite…

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1.x

Specification

PCI Express ExpressModule Electromechanical Specification Revision 1.0

This document is a companion specification to the PC…

This document is a companion specification to the PCI Express Base Specification. Its primary focus is the implementation of a modular I/O form factor that is focused on the needs of workstations and servers from mechanicals and electrical requirements. The discussions are confined to the modules and their chassis slots requirements. Other form factors are covered in other separate specifications.

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1.x

Specification

PCI Express x16 Graphics 150W-ATX Specification Revision 1.0

The objectives of this specification are Support for…

The objectives of this specification are Support for PCI Express™ graphics add-in cards that are higher power than specified in the PCI Express Card Electromechanical Specification, Forward looking for future scalability, Allow evolution of the PC architecture including graphics, Upgradeability, and Enhanced end user experience.

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1.x

Specification

PCI Express Architecture Mobile Graphics Low-Power Addendum to the PCI Express Base Specification Revision 1.0

This addendum to the PCI Express Base 1.0a describes…

This addendum to the PCI Express Base 1.0a describes a low power extension intended primarily to support the reduced power requirements of mobile platforms. Its scope is restricted to the electrical layer and corresponds to Section 4.3 of PCI Express Base 1.0a.

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1.x

Specification

PCI Express to PCI/PCI-X Bridge Specification Revision 1.0

…

This specification describes the PCI Express to PCI/PCI-X bridge (also referred to herein as PCI Express bridge) architecture, interface requirements, and the programming model.

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1.x

Specification